THROUGH HOLE
TECHNOLOGY.
Dependable through-hole assembly for products requiring mechanically robust terminations, high-power interconnects and specialist leaded components.
BUILT FOR
RELIABILITY.
Icom-Scottech provides through-hole technology (THT) assembly for products requiring mechanically robust terminations, high-power interconnects or specialist components not available in surface-mount formats.
We support prototype, pre-production and volume manufacture, assembling a broad range of leaded components including connectors, relays, transformers, power devices and bespoke electromechanical parts.
Where required, THT assembly can form part of a mixed-technology build, integrating seamlessly with SMT processes.
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ROBUST CONNECTIONS.
CONTROLLED PROCESSES.
Our through-hole assembly process combines skilled workmanship with controlled production methods to achieve reliable, repeatable connections across a wide range of applications.
COMPONENT PREPARATION
Components are prepared and, where required, leads are formed before insertion to defined orientation and height requirements.
PRECISION INSERTION
Leaded components are inserted in accordance with defined build requirements for orientation, polarity, seating and lead protrusion.
HAND & WAVE SOLDERING
Depending on the product and specification, soldering can be completed using controlled hand soldering or wave soldering processes.
THERMAL CONTROL
Defined dwell times, solder temperature control and pre-heat profiles help deliver repeatable joints while protecting heat-sensitive components.
INSPECTION & VERIFICATION
Assemblies are inspected for component identity, polarity, orientation, lead protrusion, solder wetting and joint acceptability.
CONTROLLED FROM
START TO FINISH.
Our disciplined through-hole assembly process is designed around repeatability, workmanship and dependable finished products.
COMPONENT PREPARATION
Components are identified and prepared, with lead forming completed where applicable.
INSERTION
Components are inserted to defined orientation, polarity, height and mechanical requirements.
SOLDERING
Hand or wave soldering processes are selected according to the product specification and assembly requirements.
INSPECTION
Solder joints and component installation are inspected against the build specification and IPC-aligned workmanship expectations.
FUNCTIONAL VERIFICATION
Where specified, finished assemblies can undergo functional verification against customer documentation before integration or delivery.
QUALITY BUILT
INTO EVERY JOINT.
BUILT FOR
CONFIDENCE.
To support reliability, auditability and compliance, clear build records are maintained throughout manufacture.
Where specified, component and material traceability can include batch and lot information alongside revision and configuration control.
This disciplined approach helps ensure every assembly is dependable, repeatable and aligned to customer specifications.
NEED A RELIABLE
THT ASSEMBLY PARTNER?
From prototypes and specialist assemblies to repeat production, speak to our team about your through-hole manufacturing requirements.
Through Hole Technology
Icom-Scottech provides through-hole technology (THT) assembly for products requiring mechanically robust terminations, high-power interconnects, or specialist components not available in surface-mount formats. We support prototype, pre-production and volume manufacture, assembling a broad range of leaded components including connectors, relays, transformers, power devices and bespoke electromechanical parts. Where required, THT assembly is delivered as part of a mixed-technology build, with integration to SMT processes managed to maintain consistent quality and schedule.
THT builds are undertaken using a controlled process flow, typically comprising component preparation, lead forming where applicable, insertion to defined orientation and height requirements, and soldering. Depending on the product and specification, soldering may be performed by hand soldering or wave soldering, with process parameters set to achieve reliable hole fill and consistent solder fillets whilst protecting heat-sensitive components. Thermal requirements are managed through defined dwell times, solder temperature control and, where appropriate, pre-heat profiles, supporting repeatable solder joint formation across the assembly.
Quality assurance is applied at appropriate stages throughout manufacture. Assemblies are inspected to confirm component identity, polarity and orientation, lead protrusion, solder wetting and joint acceptability in accordance with the build specification and IPC-aligned workmanship expectations. Where required by the application, cleaning processes and verification may be applied to manage residues and support long-term reliability. Any non-conformances are addressed through controlled rework and repair by trained personnel using documented methods and suitable tooling.
To support reliability, auditability and compliance, we maintain clear build records and, where specified, component and material traceability (including batch/lot information), alongside revision and configuration control. Assemblies can be subjected to functional verification in accordance with customer documentation prior to integration or delivery, providing confidence that the finished product meets electrical and mechanical requirements. This disciplined approach enables Icom-Scottech to deliver THT assemblies that are dependable, repeatable and aligned to customer specifications.