Icom-Scottech provides surface-mount technology (SMT) assembly for high-density printed circuit boards, supporting prototype, pre-production and volume manufacture. We assemble a wide range of component packages, including micro-BGA devices, 0201 passives and large form packages such as connectors, and we tailor the build approach to the product’s technical and regulatory requirements. From first article builds through to repeat production, our objective is to deliver consistent workmanship, predictable yields and robust, field-ready assemblies.

SMT builds are undertaken using a controlled, repeatable process flow, typically comprising solder paste deposition, automated component placement and reflow soldering. Where applicable, solder paste alloy/flux system and storage controls are defined, and stencil design, aperture geometry and print parameters are selected to achieve the required paste volume and solder joint formation whilst minimising defects such as bridging, insufficient solder and solder balling. Placement programmes are verified to ensure component orientation, polarity and package alignment, and feeders and nozzles are managed to maintain pick-and-place accuracy across the build. Reflow profiles are established, validated and maintained to suit the PCB construction, thermal mass and component limitations, providing stable time-above-liquidus and peak temperatures to support reliable, repeatable soldering performance. Multiple split machinery lines enable in-process inspection between each production stage, allowing issues to be identified and corrected promptly and ensuring that quality is maintained throughout the build, rather than relying solely on final inspection.

Quality assurance is applied at appropriate stages throughout manufacture. Assemblies may be inspected using visual inspection and automated optical inspection (AOI) to confirm component presence, polarity, orientation and solder joint quality; additional inspection methods can be applied where required by the build specification. Any non-conformances are managed through controlled rework and repair by trained personnel, in accordance with IPC-aligned workmanship expectations and documented work instructions.