HYBRID
TECHNOLOGY.
Integrated SMT and through-hole assembly for complex products requiring high-density circuitry alongside mechanically robust interconnects and leaded components.
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THE BEST OF
BOTH TECHNOLOGIES.
Icom-Scottech provides hybrid-technology assembly combining surface-mount technology (SMT) and through-hole technology (THT) for products requiring both high-density circuitry and mechanically robust interconnects.
Hybrid builds are particularly suited to assemblies incorporating fine-pitch SMT devices alongside connectors, power components, relays and other leaded parts.
From prototype and pre-production builds through to volume manufacture, we carefully manage the interaction between SMT and THT operations to achieve a consistent and repeatable result.
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COMPLEX ASSEMBLY.
ONE CONTROLLED ROUTE.
By controlling the interfaces between SMT and THT operations, we reduce process variability and provide a dependable manufacturing route for complex mixed-technology products.
MIXED TECHNOLOGY ASSEMBLY
Fine-pitch SMT devices can be integrated alongside connectors, relays, power components and other leaded parts within a single assembly.
CONTROLLED PROCESS SEQUENCING
SMT printing, placement and reflow are typically completed before through-hole component insertion and soldering, following a defined build sequence.
MASKING & TOOLING
Solder pallets, masking methods and fixture designs can be employed to protect sensitive areas and control solder contact during subsequent manufacturing operations.
THERMAL MANAGEMENT
Defined temperature settings, dwell times and pre-heat profiles help achieve reliable soldering without compromising adjacent SMT joints or sensitive components.
INSPECTION & AOI
SMT features can be verified using visual inspection and AOI, while through-hole joints are inspected for solder wetting, fillet formation and workmanship.
THE RIGHT PROCESS.
IN THE RIGHT ORDER.
Hybrid manufacturing depends on carefully managing each technology and the interface between them.
BUILD PLANNING
Build documentation defines assembly order, tooling, handling and process requirements before production begins.
SMT ASSEMBLY
Solder paste printing, automated component placement and controlled reflow are completed for the surface-mount elements of the assembly.
THT INSERTION
Leaded components such as connectors, power devices and relays are inserted according to the controlled build specification.
CONTROLLED SOLDERING
Wave or hand soldering is undertaken with appropriate masking, tooling and thermal controls to protect previously assembled SMT components.
INSPECTION & VERIFICATION
SMT and THT features are inspected using methods appropriate to each technology, with functional verification available where specified.
COMPLEXITY.
UNDER CONTROL.
CONTROLLED.
DOCUMENTED. VERIFIED.
Non-conformances are managed through controlled rework by trained personnel using documented methods designed to maintain product integrity.
Clear build records support auditability and compliance, with component and material traceability alongside revision and configuration control available where specified.
Assemblies can also undergo functional verification against customer documentation before integration or delivery.
READY FOR THE
NEXT STAGE.
Our integrated approach produces assemblies that are mechanically robust, electrically reliable and ready for downstream integration.
HAVE A COMPLEX
HYBRID BUILD?
Speak to our team about a dependable manufacturing route for your mixed-technology product.